M2S060-1FGG676

Product Overview

Category: Integrated Circuit (IC)

Use: The M2S060-1FGG676 is a programmable System-on-Chip (SoC) device designed for various applications in the field of digital electronics.

Characteristics: - High-performance and low-power consumption - Programmable logic capabilities - Embedded memory blocks - Multiple I/O interfaces - Flexible configuration options

Package: The M2S060-1FGG676 is available in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package.

Essence: This IC serves as a versatile platform for implementing complex digital systems with customizable functionality.

Packaging/Quantity: The M2S060-1FGG676 is typically supplied in trays or reels, with quantities varying based on customer requirements.

Specifications

• Manufacturer: Microsemi Corporation
• Model Number: M2S060-1FGG676
• Technology: Flash-based Field-Programmable Gate Array (FPGA)
• Logic Elements: 60,000
• Embedded Memory: Up to 4.5 Mb
• I/O Interfaces: LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI Express, etc.
• Operating Voltage: 1.2V
• Operating Temperature: -40°C to +100°C
• Package Dimensions: 27mm x 27mm

Detailed Pin Configuration

The M2S060-1FGG676 features a total of 676 pins distributed across its package. The pin configuration includes power supply pins, ground pins, configuration pins, input/output pins, clock pins, and specialized function pins. For a comprehensive understanding of the pin assignments, please refer to the manufacturer's datasheet.

Functional Features

• Programmable Logic: The M2S060-1FGG676 offers a high degree of flexibility in implementing custom digital logic functions, allowing designers to tailor the device to their specific requirements.
• Embedded Memory Blocks: The integrated memory blocks provide additional storage capacity for data processing and temporary storage needs.
• I/O Interfaces: The device supports various industry-standard I/O interfaces, enabling seamless integration with external devices and systems.
• Low Power Consumption: The M2S060-1FGG676 is designed to operate efficiently, minimizing power consumption while delivering high-performance capabilities.

Advantages and Disadvantages

Advantages: - Versatile programmability - High-performance capabilities - Extensive I/O interface options - Low power consumption

Disadvantages: - Steeper learning curve for programming and configuration compared to fixed-function ICs - Higher cost compared to dedicated application-specific ICs

Working Principles

The M2S060-1FGG676 utilizes flash-based FPGA technology, which allows for reprogramming of the device's internal logic and functionality. The device consists of configurable logic elements interconnected through programmable routing resources. These resources can be dynamically configured to implement desired digital circuits and functions. The user programs the device using Hardware Description Languages (HDL) or graphical design tools, which generate a configuration bitstream that is loaded onto the device.

Detailed Application Field Plans

The M2S060-1FGG676 finds applications in various fields, including but not limited to: - Communications and Networking - Industrial Automation - Aerospace and Defense - Consumer Electronics - Medical Devices - Automotive Systems

The device's versatility and programmability make it suitable for a wide range of applications requiring complex digital processing, control, and interfacing capabilities.

Detailed and Complete Alternative Models

• Xilinx Spartan-6 XC6SLX150
• Intel (Altera) Cyclone IV EP4CE115
• Lattice Semiconductor ECP5-85
• QuickLogic EOS S3
• Actel (Microsemi) ProASIC3 A3P1000

These alternative models offer similar programmable logic capabilities and can be considered as alternatives to the M2S060-1FGG676 based on specific project requirements.

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