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IS43DR81280C-3DBI-TR
Product Overview
Category
IS43DR81280C-3DBI-TR belongs to the category of dynamic random-access memory (DRAM) chips.
Use
This product is primarily used in electronic devices such as computers, smartphones, and tablets for storing and accessing data quickly.
Characteristics
- High-speed data access
- Non-volatile memory
- Low power consumption
- Compact size
Package
IS43DR81280C-3DBI-TR is available in a small form factor package, making it suitable for integration into various electronic devices.
Essence
The essence of IS43DR81280C-3DBI-TR lies in its ability to provide fast and reliable data storage and retrieval capabilities.
Packaging/Quantity
This product is typically packaged in reels or trays, with each reel or tray containing a specific quantity of IS43DR81280C-3DBI-TR chips.
Specifications
- Memory Type: Dynamic Random-Access Memory (DRAM)
- Capacity: 1280 Megabits (160 Megabytes)
- Speed: 3.2 Gigabits per second
- Voltage: 1.8 Volts
- Interface: Double Data Rate 4 (DDR4)
- Operating Temperature Range: -40°C to +85°C
Detailed Pin Configuration
The pin configuration of IS43DR81280C-3DBI-TR is as follows:
- VDD
- DQ0
- DQ1
- DQ2
- DQ3
- DQ4
- DQ5
- DQ6
- DQ7
- DQ8
- DQ9
- DQ10
- DQ11
- DQ12
- DQ13
- DQ14
- DQ15
- VSS
- BA0
- BA1
- A0
- A1
- A2
- A3
- A4
- A5
- A6
- A7
- A8
- A9
- A10
- A11
- A12
- A13
- A14
- A15
- A16
- A17
- A18
- A19
- A20
- A21
- A22
- A23
- A24
- A25
- A26
- A27
- A28
- A29
- A30
- A31
- A32
- A33
- A34
- A35
- A36
- A37
- A38
- A39
- A40
- A41
- A42
- A43
- A44
- A45
- A46
- A47
- A48
- A49
- A50
- A51
- A52
- A53
- A54
- A55
- A56
- A57
- A58
- A59
- A60
- A61
- A62
- A63
- A64
- A65
- A66
- A67
- A68
- A69
- A70
- A71
- A72
- A73
- A74
- A75
- A76
- A77
- A78
- A79
- A80
- A81
- A82
- A83
- A84
- A85
- A86
- A87
- A88
- A89
- A90
- A91
- A92
- A93
- A94
- A95
- A96
- A97
- A98
- A99
- A100
- A101
- A102
- A103
- A104
- A105
- A106
- A107
- A108
- A109
- A110
- A111
- A112
- A113
- A114
- A115
10 domande e risposte comuni relative all'applicazione di IS43DR81280C-3DBI-TR nelle soluzioni tecniche
Sure! Here are 10 common questions and answers related to the application of IS43DR81280C-3DBI-TR in technical solutions:
Question: What is IS43DR81280C-3DBI-TR?
- Answer: IS43DR81280C-3DBI-TR is a specific model of DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip.Question: What is the capacity of IS43DR81280C-3DBI-TR?
- Answer: The capacity of IS43DR81280C-3DBI-TR is 1 gigabit (Gb).Question: What is the operating voltage range for IS43DR81280C-3DBI-TR?
- Answer: The operating voltage range for IS43DR81280C-3DBI-TR is typically 1.425V to 1.575V.Question: What is the clock frequency supported by IS43DR81280C-3DBI-TR?
- Answer: IS43DR81280C-3DBI-TR supports a clock frequency of up to 800 MHz.Question: What is the data rate supported by IS43DR81280C-3DBI-TR?
- Answer: IS43DR81280C-3DBI-TR supports a data rate of up to 1600 Mbps (megabits per second).Question: What is the package type of IS43DR81280C-3DBI-TR?
- Answer: IS43DR81280C-3DBI-TR comes in a 78-ball BGA (Ball Grid Array) package.Question: What is the temperature range for IS43DR81280C-3DBI-TR?
- Answer: The temperature range for IS43DR81280C-3DBI-TR is typically -40°C to +85°C.Question: What are the typical applications of IS43DR81280C-3DBI-TR?
- Answer: IS43DR81280C-3DBI-TR is commonly used in various technical solutions, including networking equipment, telecommunications devices, industrial automation systems, and embedded computing applications.Question: Does IS43DR81280C-3DBI-TR support ECC (Error Correction Code)?
- Answer: No, IS43DR81280C-3DBI-TR does not support ECC. It is a non-ECC memory chip.Question: Can IS43DR81280C-3DBI-TR be used as a standalone memory or does it require additional components?
- Answer: IS43DR81280C-3DBI-TR can be used as a standalone memory, but it may require other supporting components such as a memory controller and power supply circuitry for proper operation in a system.
Please note that the answers provided here are general and may vary depending on specific requirements and application scenarios.